- All sections
- C - Chemistry; metallurgy
- C09J - Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives
- C09J 201/00 - Adhesives based on unspecified macromolecular compounds
Patent holdings for IPC class C09J 201/00
Total number of patents in this class: 2742
10-year publication summary
158
|
178
|
256
|
253
|
284
|
243
|
216
|
238
|
182
|
45
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Nitto Denko Corporation | 7879 |
543 |
Lintec Corporation | 1915 |
305 |
Hitachi Chemical Company, Ltd. | 2455 |
137 |
Sekisui Chemical Co., Ltd. | 3159 |
124 |
Dexerials Corporation | 1826 |
93 |
Sumitomo Chemical Company, Limited | 8808 |
62 |
FUJIFILM Corporation | 27102 |
61 |
The Furukawa Electric Co., Ltd. | 3486 |
54 |
DIC Corporation | 3597 |
54 |
Showa Denko Materials Co., Ltd. | 629 |
42 |
Mitsui Chemicals Tohcello, Inc. | 252 |
28 |
Zeon Corporation | 3854 |
27 |
Dai Nippon Printing Co., Ltd. | 3891 |
26 |
Denka Company Limited | 2189 |
26 |
Sony Chemical & Information Device Corporation | 268 |
26 |
Sumitomo Bakelite Co., Ltd. | 1416 |
25 |
Resonac Corporation | 2233 |
24 |
LG Chem, Ltd. | 17205 |
23 |
Tatsuta Electric Wire & Cable Co., Ltd. | 368 |
21 |
Henkel AG & Co. KGaA | 10129 |
20 |
Other owners | 1021 |